Includes bibliographical references.
|Statement||Stuart K. Tewksbury.|
|Series||The Kluwer international series in engineering and computer science ;, 70., VLSI, computer architecture and digital signal processing, Kluwer international series in engineering and computer science ;, SECS 70., Kluwer international series in engineering and computer science.|
|LC Classifications||TK7874 .T455 1989|
|The Physical Object|
|Pagination||xiv, 456 p. :|
|Number of Pages||456|
|LC Control Number||88036779|
In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit. Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) [Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif] on lfcmalta.com *FREE* shipping on qualifying offers. This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D lfcmalta.com: Chuan Seng Tan. Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Wafer-Level 3D System Integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences.
Jun 29, · The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process lfcmalta.com: Springer US. The department "Wafer Level System Integration" (WLSI) develops advanced packaging and system integration technologies and offers customer-specific solutions for microelectronic products in the overall scope of smart system integration. Approx. 60 scientists work at two locations: Berlin and Dresden (ASSID: All Silicon System Integration Dresden). The use of flat-panel solar photovoltaics (FPV) is growing dramatically as costs decrease. By contrast, more efficient concentrated PV systems (CPV), which focus direct sunlight onto a single point, have not been widely adopted because of their high cost, large size, and expensive tracking systems. Wafer-level integrated systems: implementation issues. [Stuart K Tewksbury] Home. WorldCat Home About WorldCat Help. Search. Search for Library Items Search for Lists Search for Contacts Search for a Library. Create Book, schema:CreativeWork;.
fabrication of the large variety of 3D integrated systems. Moreover, a single product may need several different A wafer-level 3D integration concept based on TSVs and. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts Brand: Springer US. Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging lfcmalta.com is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Get this from a library! Wafer-Level Integrated Systems: Implementation Issues. [Stuart K Tewksbury] -- From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher.